Beginning of Flip Chip Technology

Datacon - flip chip pioneer from the very beginning - offers you the ideal system for series production and R&D laboratories in this highly sophisticated technology. The three steps, namely flip the component by 180°, cover it in the slide fluxer, and bond it to the desired position on the substrate, can be processed in just one module.
Solder bump and polymer process
Cycle time approx. 0,6 sec. (w/o up-looking camera, w/o dipping)
Flux dipping process
Underfill process
Achievable placement accuracy up to ±10 µm @ 3s (cmk=1,33)
Providing the best customer support is a vital aspect of our corporate philosophy. We place great value on continuously broadening our customer support department, enabling us to provide customers with specialists at the right time and place. We understand that applications and technical expertise are critical to our customers, so we have built a team of professionals fully backed by Datacon's "know-how" to provide optimal support.

Online Flip Chip Technology by flip-chip-die-bonder.com